The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 05, 2022

Filed:

Mar. 06, 2018
Applicant:

Hkc Corporation Limited, Guangdong, CN;

Inventor:

Beizhou Huang, Chongqing, CN;

Assignee:

HKC Corporation Limited, Shenzhen, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/12 (2006.01); H01L 27/02 (2006.01); G02F 1/1362 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 27/124 (2013.01); G02F 1/136204 (2013.01); H01L 27/0292 (2013.01); H01L 22/32 (2013.01); H01L 27/0296 (2013.01);
Abstract

An array substrate, comprises: a plurality of test leads correspondingly connected to a plurality of signal lines respectively through an electrostatic protection circuit; a plurality of driving chip binding pads, which are correspondingly connected to the plurality of test leads respectively through driving signal leads, and are configured to input a driving signal sent from a driving chip to the plurality of signal lines through the plurality of test leads; and the electrostatic protection circuit, which comprises a first connection terminal electrically connected to the plurality of test leads, and a second connection terminal electrically connected to the plurality of signal lines.


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