The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 05, 2022

Filed:

Jun. 11, 2020
Applicants:

Lite-on Opto Technology (Changzhou) Co., Ltd., Changzhou, CN;

Lite-on Technology Corporation, Taipei, TW;

Inventors:

Chen-Hsiu Lin, New Taipei, TW;

Tsung-Kang Ying, New Taipei, TW;

Erh-Chan Hsu, Tainan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/18 (2006.01); H01L 33/00 (2010.01); H01L 25/16 (2006.01); H01L 33/62 (2010.01); H01L 23/485 (2006.01); H01L 25/075 (2006.01); H01L 33/50 (2010.01); H01L 33/58 (2010.01); F21V 31/00 (2006.01); H01L 33/40 (2010.01); H01L 33/56 (2010.01); H01L 33/60 (2010.01);
U.S. Cl.
CPC ...
H01L 25/167 (2013.01); F21V 31/005 (2013.01); H01L 23/485 (2013.01); H01L 25/0753 (2013.01); H01L 33/405 (2013.01); H01L 33/502 (2013.01); H01L 33/505 (2013.01); H01L 33/56 (2013.01); H01L 33/58 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01);
Abstract

A substrate structure with a buried chip and a light emitting device using the same are provided. The substrate structure includes a base layer, a control chip, a filling layer, a first upper resin layer and a first lower resin layer. The substrate layer has a first surface, a second surface opposite to the first surface, and an opening passing through the first surface and the second surface. The control chip is disposed in the opening, and an annular space having a specific width is defined by an outer wall surface of the control chip and an inner wall surface of the opening. The filling layer is filled in the annular space. The first upper resin layer and the first lower resin layer are respectively disposed on the first surface and the second surface of the base layer.


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