The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 05, 2022

Filed:

Oct. 28, 2019
Applicant:

Tdk Corporation, Tokyo, JP;

Inventors:

Toshio Sakurai, Tokyo, JP;

Hirobumi Tanaka, Tokyo, JP;

Keisuke Okai, Tokyo, JP;

Daisuke Iwanaga, Tokyo, JP;

Hisashi Nakata, Tokyo, JP;

Tomoya Shibasaki, Tokyo, JP;

Assignee:

TDK CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01G 4/232 (2006.01); H01G 4/30 (2006.01); H05K 1/18 (2006.01); H01G 4/236 (2006.01); H01G 4/12 (2006.01);
U.S. Cl.
CPC ...
H01G 4/236 (2013.01); H01G 4/30 (2013.01); H05K 1/181 (2013.01); H05K 1/186 (2013.01); H01G 4/1227 (2013.01); H01G 4/1236 (2013.01); H05K 2201/10015 (2013.01);
Abstract

A multilayer ceramic electronic component includes an element body, a via-hole electrode, and a terminal electrode. The element body includes internal electrode layers and insulation layers alternately laminated in a lamination direction. The via-hole electrode penetrates from an upper surface of the element body thereinto and is connected with at least one of the internal electrode layers. The terminal electrode is formed on the upper surface of the element body and connected with the via-hole electrode. The via-hole electrode is embedded in a via hole formed on the element body so that a predetermined clearance space is formed in the via hole.


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