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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11292874 B1

PDFFull Text
Date of Patent:
Apr. 05, 2022

Filed:

Feb. 21, 2019

Thermosetting resin composition, prepreg, fiber-reinforced plastic molded body and method for producing same

Applicant:

Mitsubishi Chemical Corporation, Chiyoda-ku, JP;

Inventors:

Takuya Teranishi, Tokyo, JP;

Masahiro Ichino, Tokyo, JP;

Kazuhisa Ikeda, Tokyo, JP;

Akira Oota, Tokyo, JP;

Assignee:

Mitsubishi Chemical Corporation, Chiyoda-ku, JP;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

David T Karst

Int. Cl.
CPC ...
C08G 59/50 (2006.01); B32B 5/26 (2006.01); C08J 5/24 (2006.01); C08G 59/30 (2006.01); C08L 63/00 (2006.01); C08K 7/04 (2006.01); B32B 27/38 (2006.01); B29C 43/20 (2006.01); C08G 59/56 (2006.01); C08G 59/18 (2006.01); C08G 59/40 (2006.01); C08K 7/02 (2006.01); C08G 59/62 (2006.01); C08L 63/04 (2006.01); B29C 70/34 (2006.01); C08G 59/22 (2006.01); C08G 59/24 (2006.01); C08G 59/28 (2006.01); C08G 59/54 (2006.01); C08G 59/60 (2006.01); B29K 63/00 (2006.01); B29K 105/08 (2006.01); B29K 307/04 (2006.01); B29K 309/08 (2006.01);
U.S. Cl.
CPC ...
C08G 59/5073 (2013.01); B29C 43/20 (2013.01); B29C 70/345 (2013.01); B32B 5/26 (2013.01); B32B 27/38 (2013.01); C08G 59/188 (2013.01); C08G 59/226 (2013.01); C08G 59/245 (2013.01); C08G 59/28 (2013.01); C08G 59/302 (2013.01); C08G 59/4021 (2013.01); C08G 59/54 (2013.01); C08G 59/56 (2013.01); C08G 59/60 (2013.01); C08G 59/62 (2013.01); C08J 5/24 (2013.01); C08K 7/02 (2013.01); C08K 7/04 (2013.01); C08L 63/00 (2013.01); C08L 63/04 (2013.01); B29K 2063/00 (2013.01); B29K 2105/089 (2013.01); B29K 2307/04 (2013.01); B29K 2309/08 (2013.01); B32B 2260/046 (2013.01); B32B 2262/101 (2013.01); B32B 2262/106 (2013.01); C08J 2363/00 (2013.01); C08J 2363/04 (2013.01);
Abstract

Provided is a thermosetting resin composition (C) of which curing can be started at a relatively low temperature in a short time and a cured product exhibits high heat resistance, the thermosetting resin composition (C) comprising an epoxy resin; an epoxy resin curing agent; and an epoxy resin curing accelerator, wherein the epoxy resin curing agent contains an imidazole-based curing agent 1 which is not encapsulated in a microcapsule and a curing agent 2 which is encapsulated in a microcapsule, and the epoxy resin curing accelerator comprises a urea derivative.

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