The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 05, 2022
Filed:
Jan. 09, 2018
Applicant:
Sumitomo Seika Chemicals Co., Ltd., Hyogo, JP;
Inventors:
Assignee:
SUMITOMO SEIKA CHEMICALS CO., LTD., Hyogo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 59/20 (2006.01); C08G 59/62 (2006.01); C08K 5/00 (2006.01); C08L 63/04 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
C08G 59/20 (2013.01); C08G 59/621 (2013.01); C08K 5/0025 (2013.01); C08L 63/04 (2013.01); H01L 23/29 (2013.01); H01L 23/31 (2013.01); H05K 1/0313 (2013.01);
Abstract
Provided is an epoxy resin composition maintaining excellent adhesion and having low dielectric tangent. Specifically, provided is an epoxy resin composition comprising a specific epoxy resin and a phenol-based curing agent.