The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 05, 2022
Filed:
Aug. 09, 2018
Mitsubishi Heavy Industries, Ltd., Tokyo, JP;
Sota Kamo, Tokyo, JP;
Kiyoka Takagi, Tokyo, JP;
Tooru Shitani, Tokyo, JP;
Toshio Abe, Nagoya, JP;
Sae Obata, Tokyo, JP;
Kosuke Takahashi, Sapporo, JP;
MITSUBISHI HEAVY INDUSTRIES, LTD., Tokyo, JP;
Abstract
A composite material includes stacked reinforced fiber substrates and has a thickness-varying part whose thickness in a stacking direction changes from a large thickness to a small thickness. The reinforced fiber substrate that has the drop-off portion and is positioned between a base substrate and a cover substrate in the stacking direction is set as a cut substrate. Stress analysis is performed on the base substrate, the cut substrate, and the cover substrate to calculate an evaluation value concerning stress on the cut substrate. A reinforced fiber substrate in the thickness-varying part is set at the cut substrate, based on the calculated evaluation value.