The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 05, 2022

Filed:

Oct. 22, 2018
Applicant:

Hamilton Sundstrand Corporation, Charlotte, NC (US);

Inventors:

Joseph V. Mantese, Ellington, CT (US);

Abhijit Chakraborty, West Hartford, CT (US);

Assignee:

HAMILTON SUNDSTRAND CORPORATION, Charlotte, NC (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 64/393 (2017.01); B29C 64/264 (2017.01); G01L 1/25 (2006.01); G01N 23/20008 (2018.01); B33Y 10/00 (2015.01); B33Y 40/00 (2020.01); B33Y 50/02 (2015.01); B33Y 70/00 (2020.01);
U.S. Cl.
CPC ...
B29C 64/393 (2017.08); B29C 64/264 (2017.08); G01L 1/25 (2013.01); G01N 23/20008 (2013.01); B33Y 10/00 (2014.12); B33Y 40/00 (2014.12); B33Y 50/02 (2014.12); B33Y 70/00 (2014.12); G01N 2223/056 (2013.01); G01N 2223/607 (2013.01); G01N 2223/646 (2013.01);
Abstract

A material deposition process including in situ sensor analysis of a component in a formation state is provided. The material deposition process is implemented in part by a sensor device of an additive manufacturing machine producing the component. The material deposition process includes sensing, by the sensing device, in situ physical properties of an area of interest of the component during a three-dimensional object production. Compliance to specifications or defects are then detected in the in situ physical properties with respect to pre-specified material requirements. The defects are analyzed to determine corrective actions, and an updated three-dimensional object production, which includes the corrective actions, is implemented to complete the component.


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