The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 05, 2022
Filed:
Mar. 16, 2018
Applicant:
Toray Industries, Inc., Tokyo, JP;
Inventors:
Assignee:
Toray Industries, Inc., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 81/02 (2006.01); B29B 7/00 (2006.01); B29C 48/00 (2019.01); B29B 7/90 (2006.01); C08G 75/0209 (2016.01); C08J 3/20 (2006.01); C08K 3/40 (2006.01); C08K 5/544 (2006.01); C08K 7/14 (2006.01); C08K 9/04 (2006.01); C08K 13/02 (2006.01); B29C 70/02 (2006.01); C08G 75/0286 (2016.01); B29B 7/86 (2006.01); C08K 9/08 (2006.01); B29K 81/00 (2006.01); B29K 309/08 (2006.01); E03C 1/02 (2006.01); B29B 7/84 (2006.01); B29B 7/46 (2006.01);
U.S. Cl.
CPC ...
B29B 7/007 (2013.01); B29B 7/86 (2013.01); B29B 7/90 (2013.01); B29C 48/022 (2019.02); B29C 70/02 (2013.01); C08G 75/0209 (2013.01); C08G 75/0286 (2013.01); C08J 3/20 (2013.01); C08J 3/201 (2013.01); C08K 3/40 (2013.01); C08K 5/544 (2013.01); C08K 7/14 (2013.01); C08K 9/04 (2013.01); C08K 9/08 (2013.01); C08K 13/02 (2013.01); C08L 81/02 (2013.01); B29B 7/46 (2013.01); B29B 7/845 (2013.01); B29K 2081/04 (2013.01); B29K 2309/08 (2013.01); E03C 1/02 (2013.01);
Abstract
A polyphenylene sulfide resin composition includes (A) 100 parts by weight of an acid-treated polyphenylene sulfide resin, (B) 10 to 100 parts by weight of a glass fiber, and (C) 0.1 to 10 parts by weight of an amino group-containing alkoxysilane compound, wherein the polyphenylene sulfide resin composition has an exothermic peak temperature (Tmc) of 195° C. to 225° C., the exothermic peak temperature being observed during a crystallization caused when the polyphenylene sulfide resin composition is melted by heating to 340° C. and then cooled at a rate of 20° C./minute, using a differential scanning calorimeter.