The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 05, 2022

Filed:

Apr. 04, 2018
Applicant:

Agathon Ag, Maschinenfabrik, Bellach, CH;

Inventors:

Jürg Marti, Solothurn, CH;

Thomas Reber, Biberist, CH;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 26/362 (2014.01); B23K 26/14 (2014.01); B23K 26/03 (2006.01); B23K 26/12 (2014.01); B23K 37/00 (2006.01); B23K 26/08 (2014.01); B23K 26/40 (2014.01); B23K 26/00 (2014.01); B23K 26/361 (2014.01);
U.S. Cl.
CPC ...
B23K 26/362 (2013.01); B23K 26/0006 (2013.01); B23K 26/03 (2013.01); B23K 26/08 (2013.01); B23K 26/125 (2013.01); B23K 26/127 (2013.01); B23K 26/14 (2013.01); B23K 26/361 (2015.10); B23K 26/40 (2013.01); B23K 37/003 (2013.01);
Abstract

The present invention relates to a laser machining system () with a control unit (), a laser ablation apparatus () and a gas supply (), wherein the laser ablation apparatus () comprises a laser () for generating a laser beam (), a laser head () including a re-directing arrangement () for directing the laser beam () of the laser () onto a surface () of a workpiece () to be machined, wherein the workpiece () is disposed in an accommodation device (), placed in a working chamber (), wherein a positioning arrangement () is provided for a relative movement between the laser head () and the workpiece () and wherein the working chamber () comprises at least one inlet () and at least one outlet () for a gas. The gas supply () of the laser machining system () is configured to provide a flow of the gas in the working chamber () and a temperature system () is provided to adjust the temperature of the gas flow ().


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