The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 05, 2022

Filed:

Oct. 19, 2016
Applicant:

Hewlett-packard Development Company, L.p., Houston, TX (US);

Inventors:

Ning Ge, Palo Alto, CA (US);

Steven J. Simske, Ft. Collins, CO (US);

Chandrakant Patel, Palo Alto, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 10/50 (2021.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 70/00 (2020.01); B33Y 40/20 (2020.01); B33Y 40/10 (2020.01); B22F 10/64 (2021.01); B22F 12/41 (2021.01); B22F 10/28 (2021.01); B22F 1/00 (2022.01);
U.S. Cl.
CPC ...
B22F 10/50 (2021.01); B22F 1/0018 (2013.01); B22F 1/0088 (2013.01); B22F 10/28 (2021.01); B22F 10/64 (2021.01); B22F 12/41 (2021.01); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 40/10 (2020.01); B33Y 40/20 (2020.01); B33Y 70/00 (2014.12); B22F 2301/052 (2013.01); B22F 2301/10 (2013.01); B22F 2301/205 (2013.01); B22F 2301/35 (2013.01); B22F 2302/253 (2013.01); B22F 2304/10 (2013.01);
Abstract

In an example of a 3D printing method, build material particles are applied to form a layer. Each build material particle includes a metal core and a metal oxide outer shell. The layer is patterned by selectively applying a reactive chemical on at least a portion of the layer to initiate a redox reaction with the metal oxide outer shells of the build material particles in contact with the reactive chemical, which reduces the metal oxide outer shells of the build material particles in contact with the reactive chemical and exposes the metal cores of the build material particles in contact with the reactive chemical. The patterned layer is exposed to rapid thermal processing to sinter the exposed metal cores to form a part layer. Any intact build material particles remain unsintered.


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