The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 05, 2022

Filed:

Aug. 26, 2020
Applicants:

Concept Laser Gmbh, Lichtenfels, DE;

Katholieke Universiteit Leuven, Leuven, BE;

Inventors:

Frank Herzog, Lichtenfels, DE;

Florian Bechmann, Lichtenfels, DE;

Sebastian Berumen, Mursbach, DE;

Jean Pierre Kruth, Leuven, BE;

Tom Craeghs, Heverlee, BE;

Assignee:

CONCEPT LASER GMBH, Lichtenfels, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B22F 10/20 (2021.01); B33Y 30/00 (2015.01); B29C 64/153 (2017.01); B23K 26/70 (2014.01); B23K 26/0622 (2014.01); B23K 31/12 (2006.01); B33Y 10/00 (2015.01); B29C 64/386 (2017.01); B33Y 40/00 (2020.01); B22F 10/30 (2021.01);
U.S. Cl.
CPC ...
B22F 10/20 (2021.01); B23K 26/0622 (2015.10); B23K 26/705 (2015.10); B23K 31/12 (2013.01); B23K 31/125 (2013.01); B29C 64/153 (2017.08); B29C 64/386 (2017.08); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B22F 10/30 (2021.01); B33Y 40/00 (2014.12); Y02P 10/25 (2015.11);
Abstract

Additive manufacturing systems may include a laser melting apparatus, a sensor device, and a visualization apparatus. A laser melting apparatus may form a three-dimensional component by exposing a powder bed to a beam of radiation based on build coordinates, with the beam of radiation providing an energy influx that generates a melt pool in a melt region of the powder bed. A sensor device may capture sensor values corresponding to the melt pool and/or the melt region. A visualization apparatus may display a representation of the three-dimensional component, with the display including the build coordinates and the sensor values in respect of a capture location thereof in the three-dimensional component. The displayed representation may be based on a display output that includes sensor values correlated with build coordinates.


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