The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 05, 2022

Filed:

Apr. 30, 2020
Applicant:

Dalian University of Technology, Dalian, CN;

Inventors:

Zhubin He, Dalian, CN;

Yi Xu, Dalian, CN;

Jiangkai Liang, Dalian, CN;

Wei Du, Dalian, CN;

Peng Lin, Dalian, CN;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B22F 10/00 (2021.01); B21D 26/041 (2011.01); B21D 26/049 (2011.01); B33Y 10/00 (2015.01); B22F 10/10 (2021.01);
U.S. Cl.
CPC ...
B22F 10/00 (2021.01); B21D 26/041 (2013.01); B21D 26/049 (2013.01); B22F 10/10 (2021.01); B22F 2202/11 (2013.01); B22F 2301/052 (2013.01); B22F 2301/205 (2013.01); B22F 2998/10 (2013.01); B33Y 10/00 (2014.12);
Abstract

The present invention discloses a method for manufacturing a thin-walled metal component by three-dimensional (3D) printing and hot gas bulging. The present invention uses 3D printing to obtain a complex thin-walled preform, which reduces a deformation during subsequent hot gas bulging. The present invention avoids local bulging thinning and cracking, undercuts at the parting during die closing, and wrinkles due to the uneven distribution of cross-sectional materials, etc. The present invention obtains a high accuracy in the form and dimension through hot gas bulging. After a desired shape is obtained by hot gas bulging, a die is closed to keep the component under high temperature and high pressure for a period of time, so that a grain and a phase of the material are transformed to form a desired microstructure.


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