The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 29, 2022

Filed:

Jan. 09, 2017
Applicants:

Samwon Act Co., Ltd., Busan, KR;

Emot Co., Ltd., Ansan-si Gyeonggi-do, KR;

Korea Institute of Machinery & Materials, Daejeon, KR;

Inventors:

Kyung Yul Lee, Bucheon-si, KR;

Kyung Wook Lee, Ansan-si, KR;

Jun Sang Jeong, Siheung-si, KR;

Yang Seok Lee, Bucheon-si, KR;

Man Kim, Changwon-si, KR;

Joo Yul Lee, Gimhae-si, KR;

Sang Yeoul Lee, Gimhae-si, KR;

Assignees:

SAMWON ACT CO., LTD., Busan, KR;

EMOT CO., LTD., Ansan-si, KR;

KOREA INSTITUTE OF MATERIALS SCIENCE, Gyeongsangnam-Do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/46 (2006.01); H05K 1/11 (2006.01); H05K 3/12 (2006.01); H05K 3/40 (2006.01); H05K 3/24 (2006.01); H05K 3/36 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4623 (2013.01); H05K 1/115 (2013.01); H05K 3/1283 (2013.01); H05K 3/245 (2013.01); H05K 3/368 (2013.01); H05K 3/4007 (2013.01); H05K 3/4038 (2013.01); H05K 2201/0305 (2013.01); H05K 2201/043 (2013.01); H05K 2201/09736 (2013.01); H05K 2203/0338 (2013.01); H05K 2203/043 (2013.01);
Abstract

The present invention relates to a circuit board including: a base board having a circuit region and a terminal region; a circuit pattern formed on an upper portion of the base board; and a low-melting-metal layer formed on an upper portion of the circuit pattern. A circuit board capable of reducing manufacturing time and manufacturing costs may be manufactured by omitting a photoresist process.


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