The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 29, 2022

Filed:

Jun. 14, 2017
Applicant:

Amosense Co., Ltd., Cheonan-si, KR;

Inventors:

Ji-Hyung Lee, Pyeongtaek-si, KR;

Ik-Seong Park, Gwanak-gu Seoul, KR;

Hyeon-Choon Cho, Seongnam-si, KR;

Assignee:

Amosense Co. Ltd., Chungcheongnam-Do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/03 (2006.01); H01L 23/498 (2006.01); H05K 3/02 (2006.01); H05K 3/06 (2006.01); H05K 3/38 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0296 (2013.01); H01L 23/49838 (2013.01); H05K 1/0306 (2013.01); H05K 3/022 (2013.01); H05K 3/061 (2013.01); H05K 3/067 (2013.01); H05K 3/381 (2013.01); H05K 2201/09827 (2013.01);
Abstract

A ceramic substrate is provided in which an inclined protrusion is formed on boundary surface of a metal layer bonded to a ceramic base so as to increase bonding strength; and a manufacturing method therefor. The inclined protrusion may include: a tapered protrusion and a multi-stepped protrusion formed on the boundary surface of the metal layer according to an interval between the metal layer bonded to the ceramic base and a neighboring metal layer, wherein a multi-stepped protrusion having an inclination angle within a predetermined angle range with respect to the ceramic base may be formed on the boundary surface of the metal layer where stress is concentrated, such as the short edge, apex, corner, and the like, and a tapered protrusion may be formed on a remaining portion of the boundary surface of the metal layer.


Find Patent Forward Citations

Loading…