The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 29, 2022
Filed:
Aug. 18, 2020
Applicant:
Seiko Epson Corporation, Tokyo, JP;
Inventors:
Suguru Uchiyama, Suwa, JP;
Yoshitaka Hama, Chino, JP;
Assignee:
SEIKO EPSON CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); G02F 1/1345 (2006.01); H05K 1/18 (2006.01); H01L 27/32 (2006.01); G02B 27/01 (2006.01);
U.S. Cl.
CPC ...
H05K 1/028 (2013.01); G02F 1/13452 (2013.01); H05K 1/0346 (2013.01); H05K 1/189 (2013.01); G02B 27/017 (2013.01); H01L 27/3276 (2013.01); H01L 27/3288 (2013.01); H05K 2201/10136 (2013.01);
Abstract
A flexible wiring substrate includes a main substrate having flexibility, a main wiring disposed over the main substrate, a second protective sheet covering the main wiring, and an insulating member partially covering the main wiring exposed from the second protective sheet and being thinner in thickness than the second protective sheet.