The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 29, 2022
Filed:
Sep. 30, 2020
Applicant:
Murata Manufacturing Co., Ltd., Nagaokakyo, JP;
Inventor:
Yusuke Kamitsubo, Nagaokakyo, JP;
Assignee:
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/11 (2006.01); H05K 1/14 (2006.01); H05K 3/00 (2006.01); H05K 3/10 (2006.01); H05K 3/40 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0271 (2013.01); H05K 1/0353 (2013.01); H05K 1/11 (2013.01); H05K 1/144 (2013.01); H05K 3/0047 (2013.01); H05K 3/101 (2013.01); H05K 3/4038 (2013.01); H05K 3/42 (2013.01); H05K 2201/015 (2013.01); H05K 2201/0141 (2013.01); H05K 2201/042 (2013.01); H05K 2201/068 (2013.01); H05K 2203/0207 (2013.01); H05K 2203/0703 (2013.01);
Abstract
A resin substrate includes a resin body, an interlayer connection conductor provided in the resin body, and a conductor pattern bonded to the interlayer connection conductor. The resin body includes a gap provided adjacent to or in a vicinity of a bonding portion of the interlayer connection conductor and the conductor pattern, and a contact portion that contacts the interlayer connection conductor.