The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 29, 2022

Filed:

Jun. 05, 2020
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Paul M. White, Sunnyvale, CA (US);

Mark H. Sherwood, San Francisco, CA (US);

Stephen M. Spiteri, Livermore, CA (US);

Zachary M. Rubin, San Jose, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03K 17/06 (2006.01); H02M 1/32 (2007.01); G01R 31/40 (2020.01); G01R 31/50 (2020.01); H02H 3/05 (2006.01); G11C 17/18 (2006.01); H02H 3/20 (2006.01); H02M 11/00 (2006.01); H02M 1/00 (2006.01);
U.S. Cl.
CPC ...
H02M 1/32 (2013.01); G01R 31/40 (2013.01); G01R 31/50 (2020.01); G11C 17/18 (2013.01); H02H 3/05 (2013.01); H02H 3/20 (2013.01); H02M 1/0009 (2021.05); H02M 11/00 (2013.01); H03K 17/06 (2013.01);
Abstract

Aspects of the present disclosure involve a power module, which may include an inverter circuit employing semiconductor switch dies. In the presence of a failure of a die, which may include an arc from a short, a sensor produces a signal responsive to the failure. The signal initiates an indirect fuse, such as a pyrotechnic element, that opens conductors associated with the die. For example, the die or a related die may be wire bonded to terminals of the module. The indirect element may therefore open the bonds to the terminals to isolate the failed die and/or related dies.


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