The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 29, 2022
Filed:
Aug. 11, 2020
Applicant:
Aac Technologies Pte. Ltd., Singapore, SG;
Assignee:
AAC Technologies Pte. Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/22 (2006.01); H01Q 1/24 (2006.01); H01Q 19/00 (2006.01); H01Q 21/00 (2006.01); H01Q 21/06 (2006.01); H01Q 21/22 (2006.01); H04M 1/02 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/2283 (2013.01); H01Q 1/243 (2013.01); H01Q 19/005 (2013.01); H01Q 21/0025 (2013.01); H01Q 21/065 (2013.01); H01Q 21/22 (2013.01); H04M 1/0283 (2013.01);
Abstract
The invention provides an antenna-in-package module and an electronic device. The antenna-in-package module comprises a substrate, an antenna module and an integrated circuit chip arranged on opposite two sides of the substrate and a circuit arranged in the substrate to connect the antenna module and the integrated circuit chip. The antenna module comprises a plurality of antenna units connected to the circuit and a plurality of guiding directors arranged separated from each antenna unit, separately. The antenna-in-package module provided by the invention can increase spatial coverage of the antenna-in-package module.