The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 29, 2022

Filed:

Jan. 11, 2019
Applicant:

Yungu (Gu' An) Technology Co., Ltd., Langfang, CN;

Inventors:

Zhenhua Xing, Kunshan, CN;

Jinqiang Liu, Kunshan, CN;

Jiamei Du, Kunshan, CN;

Yaoyan Wu, Kunshan, CN;

Yawei Liu, Kunshan, CN;

Dongkun Liu, Kunshan, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 51/52 (2006.01); H01L 33/60 (2010.01); G02F 1/133 (2006.01); F21K 9/66 (2016.01); H01L 51/56 (2006.01); G02F 1/1333 (2006.01);
U.S. Cl.
CPC ...
H01L 51/5253 (2013.01); H01L 51/529 (2013.01); H01L 51/56 (2013.01); F21K 9/66 (2016.08); G02F 1/133331 (2021.01); H01L 33/60 (2013.01); H01L 51/5218 (2013.01); H01L 51/5234 (2013.01); H01L 51/5246 (2013.01); H01L 2251/301 (2013.01); H01L 2251/308 (2013.01);
Abstract

The present disclosure relates to display panels and display devices. A display panel has a display area and a package area surrounding the display area. The display panel includes a substrate and a package cover plate bonded to the substrate in the package area via a package material melted by laser irradiation. The display area is provided with at least one mounting hole having a hole wall, and at least a portion of the hole wall of the mounting hole is coated with the package material. A protective pattern layer disposed between at least a portion of a boundary of the package area and the mounting hole is further included for blocking at least a portion of a laser beam during a movement of the laser beam from the package area to the mounting hole.


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