The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 29, 2022

Filed:

Sep. 10, 2019
Applicant:

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Yongxiang Shi, Beijing, CN;

Paoming Tsai, Beijing, CN;

Dejun Bu, Beijing, CN;

Peng Cai, Beijing, CN;

Jiahao Zhang, Beijing, CN;

Shuang Du, Beijing, CN;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 51/52 (2006.01); H01L 51/00 (2006.01);
U.S. Cl.
CPC ...
H01L 51/52 (2013.01); H01L 51/0097 (2013.01); H01L 2251/5338 (2013.01);
Abstract

The present disclosure provides a cover plate for a flexible substrate which includes a first hardened layer, a second hardened layer and a polymer thin film layer provided between the first hardened layer and the second hardened layer, wherein a hardness of the first hardened layer is less than that of the second hardened layer, a hardness of the polymer thin film layer is less than that of the first hardened layer, and a bending radius of the first hardened layer is greater than that of the second hardened layer.


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