The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 29, 2022
Filed:
May. 08, 2019
Electrical, mechanical, computing, and/or other devices formed of extremely low resistance materials
Applicant:
Ambature Inc., Scottsdale, AZ (US);
Inventors:
Douglas J. Gilbert, Flagstaff, AZ (US);
Y. Eugene Shteyn, Cupertino, CA (US);
Michael J. Smith, Seattle, WA (US);
Joel Patrick Hanna, Sacramento, CA (US);
Paul Greenland, Morgan Hill, CA (US);
Brian Coppa, Phoenix, AZ (US);
Forrest North, Palo Alto, CA (US);
Assignee:
Ambature, Inc., Scottsdale, AZ (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 1/08 (2006.01); H01L 39/00 (2006.01); H01L 39/12 (2006.01); G01L 21/12 (2006.01); G01R 33/035 (2006.01); G01K 7/00 (2006.01); H01F 6/06 (2006.01); H01L 39/14 (2006.01); H01L 39/22 (2006.01); H02K 55/00 (2006.01); H02K 3/02 (2006.01); C04B 35/45 (2006.01); H01B 1/00 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 39/126 (2013.01); C04B 35/45 (2013.01); G01K 7/006 (2013.01); G01L 21/12 (2013.01); G01R 33/0354 (2013.01); H01B 1/00 (2013.01); H01F 6/06 (2013.01); H01L 39/128 (2013.01); H01L 39/143 (2013.01); H01L 39/225 (2013.01); H02K 3/02 (2013.01); H02K 55/00 (2013.01); H01L 23/53285 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2924/01015 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/181 (2013.01); H01L 2924/3011 (2013.01); H01L 2924/3025 (2013.01); H01L 2924/30107 (2013.01); Y02E 40/60 (2013.01);
Abstract
Electrical, mechanical, computing, and/or other devices that include components formed of extremely low resistance (ELR) materials, including, but not limited to, modified ELR materials, layered ELR materials, and new ELR materials, are described.