The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 29, 2022

Filed:

Aug. 04, 2020
Applicant:

Sony Corporation, Tokyo, JP;

Inventors:

Hiroshi Takahashi, Kanagawa, JP;

Taku Umebayashi, Kanagawa, JP;

Assignee:

SONY CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); H01L 21/768 (2006.01); H01L 23/48 (2006.01); H01L 23/00 (2006.01); H01L 31/02 (2006.01); H01L 31/0203 (2014.01); H01L 31/0232 (2014.01); H01L 31/18 (2006.01); H01L 21/762 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14636 (2013.01); H01L 21/76898 (2013.01); H01L 23/481 (2013.01); H01L 24/05 (2013.01); H01L 27/1464 (2013.01); H01L 27/1469 (2013.01); H01L 27/14632 (2013.01); H01L 27/14634 (2013.01); H01L 27/14645 (2013.01); H01L 27/14687 (2013.01); H01L 31/0203 (2013.01); H01L 31/02005 (2013.01); H01L 31/02325 (2013.01); H01L 31/18 (2013.01); H01L 21/76251 (2013.01); H01L 2224/02166 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48463 (2013.01); H01L 2924/00011 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01015 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/12043 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/14 (2013.01); H01L 2924/3025 (2013.01);
Abstract

A semiconductor device having a first semiconductor section including a first wiring layer at one side thereof; a second semiconductor section including a second wiring layer at one side thereof, the first and second semiconductor sections being secured together with the respective first and second wiring layer sides of the first and second semiconductor sections facing each other; a conductive material extending through the first semiconductor section to the second wiring layer of the second semiconductor section and by means of which the first and second wiring layers are in electrical communication; and an opening, other than the opening for the conductive material, which extends through the first semiconductor section to the second wiring layer.


Find Patent Forward Citations

Takahashi, Hiroshi. (2022). Semiconductor device, manufacturing method thereof, and electronic apparatus (U.S. Patent No. 11289527). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11289527

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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