The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 29, 2022
Filed:
Nov. 20, 2019
Applicant:
At&s (Chongqing) Company Limited, Chongqing, CN;
Inventor:
Jeesoo Mok, Chongqing, CN;
Assignee:
AT&S (Chongqing) Company Limited, Chongqing, CN;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 21/56 (2006.01); H01L 23/28 (2006.01); H01L 23/538 (2006.01); H01L 21/60 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 21/56 (2013.01); H01L 23/28 (2013.01); H01L 23/5384 (2013.01); H01L 23/5385 (2013.01); H01L 2021/6027 (2013.01);
Abstract
A method of manufacturing a component carrier includes a step of stacking and connecting a first component and a second component to one another to form a cluster and thereafter, a step of inserting the cluster into a cavity of a base structure. A component carrier has a base structure with a cavity; a cluster having a first component stacked and connected with a second component, wherein the cluster is arranged in the cavity. A height difference between opposing lateral sidewalls of the cluster is less than 15 μm.