The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 29, 2022
Filed:
May. 08, 2020
Applicant:
Tanaka Denshi Kogyo K.k., Saga, JP;
Inventors:
Assignee:
Tanaka Denshi Kogyo K.K., Kanzaki-gun, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/495 (2006.01); H01L 23/31 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/45 (2013.01); H01L 23/3121 (2013.01); H01L 23/4952 (2013.01); H01L 24/48 (2013.01); H01L 25/0652 (2013.01); H01L 25/50 (2013.01); H01L 2224/45139 (2013.01); H01L 2224/45565 (2013.01); H01L 2224/45644 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48247 (2013.01);
Abstract
A gold-coated silver bonding wire includes: a core material containing silver as a main component; and a coating layer provided on a surface of the core material and containing gold as a main component. The gold-coated silver bonding wire contains gold in a range of not less than 2 mass % nor more than 7 mass %, and at least one sulfur group element selected from the group consisting of sulfur, selenium, and tellurium in a range of not less than 1 mass ppm nor more than 80 mass ppm, with respect to a total content of the bonding wire.