The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 29, 2022
Filed:
Jul. 03, 2018
Siemens Aktiengesellschaft, Munich, DE;
Rene Blank, Berlin, DE;
Martin Franke, Berlin, DE;
Peter Frühauf, Falkensee, DE;
Rüdiger Knofe, Teltow, DE;
Bernd Müller, Falkenberg, DE;
Stefan Nerreter, Heidesee OT Blossin, DE;
Jörg Strogies, Berlin, DE;
Klaus Wilke, Berlin, DE;
SIEMENS AKTIENGESELLSCHAFT, Munich, DE;
Abstract
Various embodiments include a semiconductor component comprising: a first carrier part; a second carrier part arranged opposite the first carrier part; a semiconductor element arranged between the first carrier part and the second carrier part; a contact surface arranged on one of the parts; a contact sleeve arranged on one of the carrier parts opposite the contact surface; and a contact pin with, at one axial end, an end face providing an electrical contact connection of the contact surface and, in a region averted from said axial end, a connection region for the connection of the contact pin with the contact sleeve by means of press fitting. At least one of the first carrier part or the second carrier part comprises a printed conductor connected to the contact surface and/or to the contact sleeve.