The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 29, 2022
Filed:
Jul. 27, 2020
Applicant:
Rohm Co., Ltd., Kyoto, JP;
Inventors:
Satoshi Kageyama, Kyoto, JP;
Yoshihisa Takada, Kyoto, JP;
Assignee:
ROHM Co., Ltd., Kyoto, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/488 (2006.01); H01L 23/00 (2006.01); H01L 23/04 (2006.01); H01L 23/12 (2006.01);
U.S. Cl.
CPC ...
H01L 23/488 (2013.01); H01L 23/04 (2013.01); H01L 23/12 (2013.01); H01L 24/14 (2013.01);
Abstract
There is provided a semiconductor device that includes a wiring layer having a main surface and a rear surface which face opposite sides in a thickness direction, a first insulating layer covering an entirety of the rear surface, a second insulating layer which is in contact with the main surface, a semiconductor element which faces the second insulating layer and is mounted on the wiring layer, and a sealing resin which is in contact with the second insulating layer and covers the semiconductor element, wherein surface roughness of the main surface is larger than surface roughness of the rear surface.