The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 29, 2022

Filed:

Jun. 28, 2018
Applicant:

Nederlandse Organisatie Voor Toegepast-natuurwetenschappelijk Onderzoek Tno, 's-Gravenhage, NL;

Inventors:

Violeta Navarro Paredes, 's-Gravenhage, NL;

Abbas Mohtashami, 's-Gravenhage, NL;

Hamed Sadeghian Marnani, Nootdorp, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 29/06 (2006.01); G01Q 60/38 (2010.01); G01Q 70/12 (2010.01); G01Q 70/14 (2010.01); G01Q 70/00 (2010.01); H01L 21/768 (2006.01); G01Q 80/00 (2010.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76805 (2013.01); G01N 29/0681 (2013.01); G01Q 60/38 (2013.01); G01Q 70/12 (2013.01); G01Q 70/14 (2013.01); G01Q 80/00 (2013.01); H01L 22/20 (2013.01); G01N 29/069 (2013.01); G01N 2291/2697 (2013.01);
Abstract

This document is directed at a method of manufacturing a semiconductor element, the method comprising manipulating a surface of a substrate using an atomic force microscope, the atomic force microscope including a probe, the probe including a cantilever and a probe tip, the substrate including at least one or more device features embedded underneath the surface. The method comprises: imaging the embedded device features, and identifying that a position of the probe tip of the atomic force microscope is aligned with the feature; and displacing the probe tip transverse to the surface for exerting a stress for performing the step of surface manipulation, as for example contact holes. Imaging is performed by applying and obtaining an acoustic signal to and from the substrate via the probe tip, including a first and a second signal component at different frequencies. The imaging and surface manipulation are performed using said same probe and probe tip.


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