The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 29, 2022
Filed:
Oct. 24, 2019
Applicant:
Applied Materials, Inc., Santa Clara, CA (US);
Inventors:
Ramesh Krishnamurthy, Los Altos, CA (US);
Lakshmanan Karuppiah, San Jose, CA (US);
Assignee:
APPLIED MATERIALS, INC., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); G05B 19/418 (2006.01); G01N 21/84 (2006.01); G01N 21/35 (2014.01); G01J 5/00 (2022.01); G01B 11/06 (2006.01); G01N 21/3563 (2014.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67276 (2013.01); G01B 11/0691 (2013.01); G01J 5/0022 (2013.01); G01N 21/3563 (2013.01); G01N 21/84 (2013.01); G05B 19/41875 (2013.01); H01L 21/67253 (2013.01); H01L 21/68764 (2013.01); H01L 21/68771 (2013.01); G01N 2021/3568 (2013.01); G05B 2219/40066 (2013.01);
Abstract
Methods and apparatus for the in-situ measurement of metrology parameters are disclosed herein. Some embodiments of the disclosure further provide for the real-time adjustment of process parameters based on the measure metrology parameters. Some embodiments of the disclosure provide for a multi-stage processing chamber top plate with one or more sensors between process stations.