The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 29, 2022

Filed:

Aug. 06, 2020
Applicant:

Tdk Corporation, Tokyo, JP;

Inventors:

Yuichi Nagai, Tokyo, JP;

Takehisa Tamura, Tokyo, JP;

Shinya Onodera, Tokyo, JP;

Ken Morita, Tokyo, JP;

Atsushi Takeda, Tokyo, JP;

Assignee:

TDK CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/008 (2006.01); H01G 4/30 (2006.01); H01G 4/232 (2006.01);
U.S. Cl.
CPC ...
H01G 4/008 (2013.01); H01G 4/232 (2013.01); H01G 4/30 (2013.01);
Abstract

A conductive resin layer includes a first region positioned on the end surface, a second region positioned on the side surface, and a third region positioned on a ridge portion between the end surface and the side surface. In a case where a maximum thickness of the first region is T(μm) and a maximum thickness of the second region is T(μm), the maximum thickness Tand the maximum thickness Tsatisfy a relation of2/1≥0.11. In a cross-section along a thickness direction of the third region, a total area of the voids in the third region is in a range of 3.0 to 11.0% of an area of the third region.


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