The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 29, 2022

Filed:

Oct. 31, 2017
Applicant:

Lg Hausys, Ltd., Seoul, KR;

Inventors:

Geo-Hyeok Lim, Boryeong-si, KR;

Seung-Hun Lee, Seoul, KR;

Ji-Yong Park, Gimhae-si, KR;

Han-Na Lee, Ansan-si, KR;

Assignee:

LG HAUSYS, LTD., Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/00 (2006.01); G03F 7/38 (2006.01); B32B 27/06 (2006.01); G03F 7/20 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0002 (2013.01); B32B 27/06 (2013.01); G03F 7/00 (2013.01); G03F 7/20 (2013.01); G03F 7/38 (2013.01);
Abstract

Provided are a decoration sheet and a method for producing same. The decoration sheet sequentially includes a thermosetting resin layer, a deposition layer, and a base layer. The thermosetting resin layer has a micropattern on a surface thereof, and the elongation rate of the sheet is 200% to 300%. The method includes forming a photocurable imprint film having a first pattern on a first surface thereof, forming a thermosetting resin layer having a second pattern, which has a reverse phase to the first pattern, on a first surface thereof, forming a deposition layer on a second surface of the thermosetting resin layer, forming a substrate layer on one surface of the deposition layer, and releasing the photocurable imprint film from the thermosetting resin layer.


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