The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 29, 2022

Filed:

Sep. 30, 2019
Applicant:

Itron Global Sarl, Liberty Lake, WA (US);

Inventors:

Abbas Sabraoui, Liberty Lake, WA (US);

Michel Bottner, Liberty Lake, WA (US);

Stephane Vago, Liberty Lake, WA (US);

Gregory Pastor, Liberty Lake, WA (US);

Assignee:

Itron Global SARL, Liberty Lake, WA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01F 1/66 (2006.01); G01F 15/14 (2006.01); H04R 1/02 (2006.01); G01D 11/24 (2006.01); G01N 29/22 (2006.01); G01N 29/24 (2006.01);
U.S. Cl.
CPC ...
G01F 1/662 (2013.01); G01D 11/245 (2013.01); G01F 15/14 (2013.01); G01N 29/222 (2013.01); G01N 29/227 (2013.01); H04R 1/02 (2013.01); G01N 29/223 (2013.01); G01N 29/2437 (2013.01);
Abstract

Techniques are disclosed for configuring a bi-material enclosure for an acoustic sensor assembly, such as for use in a water or gas metering applications, or other applications using piezo and/or transducer devices. A plastic housing with mechanical reinforcements (e.g., 40% glass fiber) provides the advantage of strength and resistance to a high-pressure environment encountered during use. Use of a plastic sleeve having less or no reinforcements provides more consistent signal reception and data generation between different transducer assemblies under the same or similar conditions. Accordingly, the bi-material transducer enclosure provides a high resistance to pressure and/or high reproducibility of signal-transmission characteristics between transducer assemblies.


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