The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 29, 2022

Filed:

Mar. 07, 2019
Applicant:

Lg Electronics Inc., Seoul, KR;

Inventors:

Woosung Lee, Seoul, KR;

Jihun Lee, Seoul, KR;

Assignee:

LG Electronics Inc., Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28D 15/02 (2006.01); F25B 21/02 (2006.01); F25D 17/02 (2006.01); F25D 23/00 (2006.01); F25D 17/06 (2006.01); F28D 15/04 (2006.01); F28F 1/32 (2006.01);
U.S. Cl.
CPC ...
F28D 15/0275 (2013.01); F25B 21/02 (2013.01); F25D 17/02 (2013.01); F25D 17/062 (2013.01); F25D 23/003 (2013.01); F25D 23/006 (2013.01); F28D 15/04 (2013.01); F28F 1/32 (2013.01); F25B 2321/023 (2013.01); F25B 2321/025 (2013.01); F25B 2321/0211 (2013.01); F25B 2321/0252 (2013.01); F25D 2323/0021 (2013.01); F28F 2250/08 (2013.01);
Abstract

A refrigerator may include an inner casing having a storage chamber defined therein; and a thermoelectric module including a thermoelectric element for cooling the storage chamber, a cooling sink in contact with one surface of thermoelectric element, and a heat sink contacting the other surface of thermoelectric element, wherein the heat sink includes: a heat dissipation fin including a stack of a plurality of fins; a heat dissipation plate coupled to the heat dissipation fin; a heat dissipation pipe for connecting the heat dissipation plate to the heat dissipation fin, wherein the heat dissipation pipe is arranged to pass through the heat dissipation fin.


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