The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 29, 2022
Filed:
Jun. 28, 2017
Applicant:
Toray Industries, Inc., Tokyo, JP;
Inventors:
Haruki Okuda, Ehime, JP;
Tomohisa Noguchi, Ehime, JP;
Yusuke Hiraike, Ehime, JP;
Fumihiko Tanaka, Ehime, JP;
Assignee:
Toray Industries, Inc., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
D01F 9/22 (2006.01); D01D 1/10 (2006.01); D01F 6/18 (2006.01);
U.S. Cl.
CPC ...
D01F 9/225 (2013.01); D01D 1/10 (2013.01); D01D 1/106 (2013.01); D01F 6/18 (2013.01); D01F 9/22 (2013.01); D10B 2321/10 (2013.01);
Abstract
A carbon fiber bundle is characterized in that a ratio (n/N) of a number n of pairs wherein a flaw of 50 nm in size or more is present on at least one of the fracture surfaces forming the pair to a total number N of pairs of fiber fracture surfaces selected at random after performing a single fiber tensile test for a gauge length of 10 mm is 35% or less, and in that a single-fiber diameter d is 4.3 μm or more.