The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 29, 2022

Filed:

Jul. 31, 2017
Applicant:

The Regents of the University of California, Oakland, CA (US);

Inventors:

Clayton J. Cozzan, Goleta, CA (US);

Steven P. DenBaars, Goleta, CA (US);

Ram Seshadri, Goleta, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09K 11/02 (2006.01); F21K 9/64 (2016.01); F21K 9/68 (2016.01); C04B 35/10 (2006.01); C04B 35/44 (2006.01); C04B 35/645 (2006.01); C09K 11/77 (2006.01); C04B 35/117 (2006.01); H01L 33/50 (2010.01); H05B 33/20 (2006.01); H01L 31/055 (2014.01); H05B 33/14 (2006.01); F21Y 115/30 (2016.01); F21Y 115/10 (2016.01);
U.S. Cl.
CPC ...
C09K 11/02 (2013.01); C04B 35/10 (2013.01); C04B 35/117 (2013.01); C04B 35/44 (2013.01); C04B 35/645 (2013.01); C09K 11/7774 (2013.01); F21K 9/64 (2016.08); F21K 9/68 (2016.08); H01L 31/055 (2013.01); H01L 33/501 (2013.01); H01L 33/502 (2013.01); H05B 33/14 (2013.01); H05B 33/20 (2013.01); C04B 2235/3217 (2013.01); C04B 2235/3222 (2013.01); C04B 2235/3225 (2013.01); C04B 2235/3229 (2013.01); C04B 2235/6562 (2013.01); C04B 2235/6565 (2013.01); C04B 2235/6567 (2013.01); C04B 2235/6581 (2013.01); C04B 2235/6582 (2013.01); C04B 2235/662 (2013.01); C04B 2235/664 (2013.01); C04B 2235/666 (2013.01); C04B 2235/77 (2013.01); C04B 2235/80 (2013.01); C04B 2235/9607 (2013.01); C04B 2235/9646 (2013.01); F21Y 2115/10 (2016.08); F21Y 2115/30 (2016.08); H01L 2933/0041 (2013.01); Y02B 20/00 (2013.01); Y02E 10/52 (2013.01);
Abstract

A method for fabricating a composite useful in a white light emitting device, includes mixing a phosphor and a filler to form a mixture; sintering the mixture (e.g., using spark plasma sintering) to form a composite; and annealing the composite to reduce oxygen vacancies and improve optical properties of the composite. Also disclosed is a white light emitting device including a laser diode or light emitting diode optically pumping the phosphor in the composite to produce white light. The composite fabricated using the method (and having. e.g., at most 50% phosphor by weight) can (1) reduce an operating temperature of the phosphor by 55 degrees, (2) increase an external quantum efficiency (e.g., by at least 15%) of the white light emitting device, and (3) result in color points and quality of the white light that is equal to or improved, as compared to without the filler.


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