The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 29, 2022
Filed:
Sep. 08, 2016
Applicant:
Leibniz-institut Für Neue Materialien Gemeinnützige Gmbh, Saarbrücken, DE;
Inventors:
Beate Reiser, Kaiserslautern, DE;
Tobias Kraus, Saarbrücken, DE;
Lola González-García, Saarbrücken, DE;
Johannes H. M. Maurer, Homburg, DE;
Ioannis Kanelidis, Saarbrücken, DE;
Assignee:
Leibniz-Institut für Neue Materialien gemeinnützige GmbH, Saarbrücken, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09D 5/24 (2006.01); C09D 11/52 (2014.01); C09D 11/322 (2014.01); C09D 7/40 (2018.01); H01B 1/20 (2006.01); C09D 11/106 (2014.01); C09D 7/62 (2018.01); B82Y 40/00 (2011.01); B05D 3/04 (2006.01); C09D 11/037 (2014.01); C09D 11/102 (2014.01); C09D 165/00 (2006.01); H01B 1/12 (2006.01); H01B 1/22 (2006.01); C08K 9/04 (2006.01); C08K 3/08 (2006.01); C08K 7/06 (2006.01); C08K 7/00 (2006.01); H01L 31/0224 (2006.01);
U.S. Cl.
CPC ...
C09D 5/24 (2013.01); B05D 3/0413 (2013.01); B82Y 40/00 (2013.01); C09D 7/62 (2018.01); C09D 7/70 (2018.01); C09D 11/037 (2013.01); C09D 11/102 (2013.01); C09D 11/106 (2013.01); C09D 11/322 (2013.01); C09D 11/52 (2013.01); C09D 165/00 (2013.01); H01B 1/124 (2013.01); H01B 1/20 (2013.01); H01B 1/22 (2013.01); C08K 3/08 (2013.01); C08K 7/00 (2013.01); C08K 7/06 (2013.01); C08K 9/04 (2013.01); C08K 2003/0831 (2013.01); C08K 2201/001 (2013.01); C08K 2201/011 (2013.01); H01L 31/022425 (2013.01);
Abstract
Conductive or semiconductive nanoparticles are modified with conductive ligands so as to be able to obtain conductive or semiconductive layers without requiring a thermal treatment for forming the structures upon application of the layers. A composition can include a matrix polymer for producing conductive composites.