The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 29, 2022
Filed:
Apr. 22, 2021
Heedae Park, Busan, KR;
Heedae Park, Busan, KR;
Other;
Abstract
The present invention relates to a thermoplastic hot melt film having excellent adhesive strength in which hydrophobic nanosilica is mixed. The resin composition contains nanosilica having a particle size of 1 to 100 nm and containing hydrophobic functional groups on its surface in the range of 0.1 to 5 phr (Parts per Hundred Resin), and the nanosilica forms nanosilica aggregates with an average size of the aggregates is within 100˜1200 nm. The thickness of the thermoplastic hot melt film is 0.02˜0.3 mm. The thermoplastic hot melt film of the present invention is mixed with nanosilica containing hydrophobic functional groups, lipophilic, on the surface to improve dispersibility, strengthen water resistance, and increase tensile strength. The material cost is reduced while securing one adhesive strength and excellent durability, and multi-press molding is possible, which has the effect of increasing energy saving and productivity.