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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11286358 B1

PDFFull Text
Date of Patent:
Mar. 29, 2022

Filed:

Mar. 21, 2018

Molding compound having randomly oriented filaments and methods for making and using same

Applicant:

Dow Global Technologies Llc, Midland, MI (US);

Inventors:

Jason A. Reese, Auburn, MI (US);

Richard Baumer, Midland, MI (US);

David H. Bank, Midland, MI (US);

Amit K. Chaudhary, Midland, MI (US);

Assignee:

Dow Global Technologies LLC, Midland, MI (US);

Attorney:
Primary Examiner:

Michael M Robinson

Int. Cl.
CPC ...
C08J 5/24 (2006.01); C08G 59/50 (2006.01); C08G 59/26 (2006.01); B29B 15/14 (2006.01); B29C 70/40 (2006.01); B29C 70/22 (2006.01); B29C 70/16 (2006.01); B29C 70/18 (2006.01); B29C 70/38 (2006.01); B29K 105/00 (2006.01); B29K 63/00 (2006.01); B29K 105/08 (2006.01);
U.S. Cl.
CPC ...
C08J 5/24 (2013.01); B29B 15/14 (2013.01); B29C 70/16 (2013.01); B29C 70/18 (2013.01); B29C 70/22 (2013.01); B29C 70/38 (2013.01); B29C 70/40 (2013.01); C08G 59/26 (2013.01); C08G 59/5006 (2013.01); B29K 2063/00 (2013.01); B29K 2105/0014 (2013.01); B29K 2105/0881 (2013.01); C08J 2363/04 (2013.01);
Abstract

A molding compound is made by heat-softening, fusing and compressing strips of unidirectionally aligned filaments embedded in a thermosetting resin. The thermosetting resin is non-tacky at room temperature, which allows for easy handling, elimination of cold storage and the use of robotic manufacturing methods. Composites made by molding the molding compound have excellent, highly isotropic tensile properties.

Find Patent Forward Citations

Reese, Jason. (2022). Molding compound having randomly oriented filaments and methods for making and using same (U.S. Patent No. 11286358). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11286358

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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