The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 29, 2022
Filed:
Jan. 30, 2014
Toyo Tanso Co., Ltd., Osaka, JP;
Yoshinari Miyamoto, Osaka, JP;
Ichiro Fujita, Osaka, JP;
Megumu Doi, Osaka, JP;
Taihei Matsumoto, Osaka, JP;
Tomoyuki Okuni, Osaka, JP;
Fumishige Nakamura, Osaka, JP;
Weiwu Chen, Suita, JP;
TOYO TANSO CO., LTD., Osaka, JP;
Abstract
A joined material and a method of manufacturing the joined material are provided which enable a metal layer and a carbon material layer to be easily joined to each other while making the thickness of the metal layer larger and which can inhibit failure. A joined material includes a CFC layer () and a tungsten layer () that are joined to each other. A sintered tungsten carbide layer (), a mixed layer () of SiC and WC, and SiC and WC () that have been sintered while intruding into the CFC layer (), are formed between the CFC layer () and the tungsten layer (), and these layers (, and) are joined to each other by sintering.