The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 29, 2022

Filed:

Jul. 09, 2020
Applicant:

Yazaki Corporation, Tokyo, JP;

Inventors:

Satoshi Enomoto, Utsunomiya, JP;

Masashi Nakamura, Utsunomiya, JP;

Shinichi Tadokoro, Utsunomiya, JP;

Tomokazu Kato, Utsunomiya, JP;

Assignee:

YAZAKI CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B60R 16/02 (2006.01); H01B 7/00 (2006.01); H01B 13/012 (2006.01);
U.S. Cl.
CPC ...
B60R 16/0215 (2013.01); H01B 7/0045 (2013.01); H01B 13/01209 (2013.01);
Abstract

A wire harness routing structure for a panel, includes: a panel member that includes a first surface and a second surface opposite to the first surface; and a wire harness that is routed to the panel member. The first surface has a harness accommodating groove that accommodates a harness main body of the wire harness, the harness accommodating groove being recessed toward the second surface. A resin cured portion that holds the harness main body is formed in the harness accommodating groove. The resin cured portion is formed by a resin with which a predetermined range of the harness accommodating groove is filled and which is cured.


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