The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 29, 2022

Filed:

Nov. 13, 2018
Applicant:

Yoshino Kogyosho Co., Ltd., Tokyo, JP;

Inventors:

Mitsuru Shiokawa, Tokyo, JP;

Hideaki Hoshino, Tokyo, JP;

Yuichi Okuyama, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 49/46 (2006.01); B29C 49/58 (2006.01); B29C 49/12 (2006.01);
U.S. Cl.
CPC ...
B29C 49/12 (2013.01); B29C 49/46 (2013.01);
Abstract

A liquid blow molding device includes: a supply block including a supply path; a blow nozzle detachably attached to the supply block; a pressurized liquid supply unit configured to supply the pressurized liquid to the blow nozzle; an annular-shaped sealing surface that is provided in a portion of the supply block that is located between an inner circumferential surface defining the supply path and the outlet and that surrounds an entire circumference of the outlet; and a sealing body that is disposed inside the supply path and that is displaceable between a closing position, in which the sealing body abuts against the sealing surface to close the outlet, and an opening position, in which the sealing body is spaced from the sealing surface to open the outlet.


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