The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 29, 2022

Filed:

Sep. 05, 2019
Applicant:

Tactotek Oy, Oulunsalo, FI;

Inventors:

Anne Isohätälä, Oulunsalo, FI;

Hasse Sinivaara, Oulunsalo, FI;

Mikko Heikkinen, Oulunsalo, FI;

Assignee:

TACTOTEK OY, Oulunsalo, FI;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 45/14 (2006.01); B29C 45/16 (2006.01); G01D 5/24 (2006.01); H01F 27/28 (2006.01); H01F 38/14 (2006.01); H01F 41/04 (2006.01); B29L 31/34 (2006.01); H01Q 9/04 (2006.01); B29B 11/06 (2006.01); B29K 705/00 (2006.01);
U.S. Cl.
CPC ...
B29C 45/14639 (2013.01); B29B 11/06 (2013.01); B29C 45/1642 (2013.01); B29C 45/1671 (2013.01); G01D 5/24 (2013.01); H01F 27/28 (2013.01); H01F 38/14 (2013.01); H01F 41/04 (2013.01); H01Q 9/0407 (2013.01); B29C 2045/14532 (2013.01); B29C 2045/14663 (2013.01); B29K 2705/00 (2013.01); B29L 2031/3406 (2013.01); B29L 2031/3456 (2013.01); Y10T 29/49016 (2015.01);
Abstract

A method, for manufacturing an electronic assembly, such as an antenna or a capacitive sensing device or a coupled inductor, comprising at least a first electrically conductive element and a second electrically conductive element is presented. The method comprises obtaining said electrically conductive elements, such as patch elements, arranging said electrically conductive elements, such as inside of a cavity defined by a mold structure, at a pre-defined distance from each other for establishing an electromagnetic coupling between said electrically conductive elements, and molding, such as injection molding, a molding material layer at least between said electrically conductive elements, wherein the molding material layer has a thickness between said electrically conductive elements defined by the pre-defined distance. In addition, electronic assemblies, antennas, capacitive sensing devices and coupled inductors are presented.


Find Patent Forward Citations

Isohätälä, Anne. (2022). Method for manufacturing an electronic assembly and an electronic assembly (U.S. Patent No. 11285645). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11285645

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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