The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 29, 2022
Filed:
Apr. 23, 2018
Applicant:
Siemens Aktiengesellschaft, Munich, DE;
Inventors:
Assignee:
SIEMENS AKTIENGESELLSCHAFT, Munich, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/00 (2006.01); B23K 35/02 (2006.01); B23K 35/26 (2006.01); B23K 35/30 (2006.01); B23K 101/36 (2006.01);
U.S. Cl.
CPC ...
B23K 35/025 (2013.01); B23K 35/262 (2013.01); B23K 35/302 (2013.01); B23K 2101/36 (2018.08);
Abstract
Various embodiments include a solder preform for establishing a diffusion solder connection comprising: a microstructure including a solder material and a metallic material; a first joining surface for a first joining partner and a second joining surface for a second joining partner; and a diffusion zone comprising an intermetallic compound of at least some of the solder material and at least some of the metallic material. The first joining surface and the second joining surface include at least some solder material.