The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 29, 2022

Filed:

Sep. 28, 2018
Applicant:

Uchicago Argonne, Llc, Chicago, IL (US);

Inventors:

Abdellatif M. Yacout, Naperville, IL (US);

Sumit Bhattacharya, Darien, IL (US);

Assignee:

UCHICAGO ARGONNE, LLC, Chicago, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 3/00 (2021.01); B22F 1/00 (2006.01); B22F 3/093 (2006.01); C01G 43/01 (2006.01); B82Y 30/00 (2011.01); C01G 56/00 (2006.01); C22C 28/00 (2006.01);
U.S. Cl.
CPC ...
B22F 3/004 (2013.01); B22F 1/0022 (2013.01); B22F 1/0074 (2013.01); B22F 3/093 (2013.01); C01G 43/01 (2013.01); C01G 56/00 (2013.01); C22C 28/00 (2013.01); B22F 2202/01 (2013.01); B22F 2301/10 (2013.01); B22F 2301/15 (2013.01); B22F 2302/253 (2013.01); B22F 2304/054 (2013.01); B22F 2304/056 (2013.01); B22F 2304/058 (2013.01); B22F 2304/10 (2013.01); B82Y 30/00 (2013.01);
Abstract

A method loading powder into a mold can include immersing the mold comprising one or more microchannels into a suspension comprising the powder and a surfactant suspended in a dispersant, wherein the powder comprises particles having an average particle size of less than 100 μm, wherein the mold is substantially entirely covered by the suspension; heating the suspension having the mold immersed therein under a temperature condition suitable to lower the stability of the particles of the powder in the suspension such that the particles settle out of solution and into the one or more microchannels; and applying an ultrasonic wave to the heated suspension to further settle the particles of the powder into the one or more microchannels thereby filling the one or more microchannels of the mold with the powder.


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