The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 22, 2022
Filed:
Oct. 01, 2019
Elbit Systems Ltd., Haifa, IL;
Oleg Naigertsik, Haifa, IL;
Alex Fischman, Tal-El, IL;
Ian Engleman, Yoqneam Illit, IL;
Isaac Jak Kettner, Haifa, IL;
Elbit Systems Ltd., Haifa, IL;
Abstract
A first thermal management approach involves an air flow through cooling mechanism with multiple airflow channels for dissipating heat generated in a PCA. The air flow direction through at least one of the channels is different from the air flow direction through at least another of the channels. Alternatively or additionally, the airflow inlet of at least one channel is off-axis with respect to the airflow outlet. A second thermal management approach involves the fabrication of a PCB with enhanced durability by mitigating via cracking or PTH fatigue. At least one PCB layer is composed of a base material formed from a 3D woven fiberglass fabric, and conductive material deposited onto the base material surface. A conductive PTH extends through the base material of multiple PCB layers, where the CTE of the base material along the z-axis direction substantially matches the CTE of the conductive material along the x-axis direction.