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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11284506 B1

PDFFull Text
Date of Patent:
Mar. 22, 2022

Filed:

Dec. 09, 2020

High frequency module, board equipped with antenna, and high frequency circuit board

Applicant:

Murata Manufacturing Co., Ltd., Kyoto, JP;

Inventor:

Hideki Ueda, Kyoto, JP;

Assignee:

MURATA MANUFACTURING CO., LTD., Kyoto, JP;

Attorney:

Pearne & Gordon LLP

Primary Examiner:

Hoag C Nguyen

Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01Q 1/38 (2006.01); H01Q 1/22 (2006.01); H01Q 21/06 (2006.01); H01L 23/66 (2006.01); H01P 3/08 (2006.01); H01Q 1/12 (2006.01); H01Q 1/48 (2006.01); H05K 1/11 (2006.01); H05K 3/34 (2006.01); H01L 23/552 (2006.01); H01L 23/60 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0218 (2013.01); H01L 23/66 (2013.01); H01P 3/08 (2013.01); H01Q 1/12 (2013.01); H01Q 1/2283 (2013.01); H01Q 1/38 (2013.01); H01Q 1/48 (2013.01); H01Q 21/06 (2013.01); H05K 1/0219 (2013.01); H05K 1/0222 (2013.01); H05K 1/0239 (2013.01); H05K 1/11 (2013.01); H01L 23/552 (2013.01); H01L 23/60 (2013.01); H01L 24/16 (2013.01); H01L 2223/6627 (2013.01); H01L 2223/6655 (2013.01); H01L 2223/6677 (2013.01); H01L 2223/6683 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/1421 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/19031 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/3025 (2013.01); H05K 3/3436 (2013.01); H05K 2201/10734 (2013.01); H05K 2203/041 (2013.01);
Abstract

A first board includes a first ground plane, a first ground land, a first transmission line, and a first signal land connected to the first transmission line, wherein the first ground land and the first signal land are formed on the same surface. A second board includes a second ground plane, a second ground land, a second transmission line, and a second signal land connected to the second transmission line, wherein the second ground land and the second signal land are formed on a surface opposing the first board. The second ground land and the second signal land oppose the first ground land and the first signal land, respectively. A conduction member connects the first ground land and the second ground land. The first signal land and the second signal land are connected by capacitance coupling without using any conductor.

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