The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 22, 2022
Filed:
May. 10, 2019
Applicant:
Nitto Denko Corporation, Osaka, JP;
Inventors:
Masaki Ito, Osaka, JP;
Naoki Shibata, Osaka, JP;
Yasunari Oyabu, Osaka, JP;
Kenya Takimoto, Osaka, JP;
Assignee:
NITTO DENKO CORPORATION, Osaka, JP;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/02 (2006.01); H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/20 (2006.01); H05K 3/28 (2006.01); H05K 3/38 (2006.01); H05K 3/44 (2006.01); H05K 7/00 (2006.01); H05K 7/20 (2006.01); H05K 1/05 (2006.01); H05K 3/10 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0209 (2013.01); H05K 3/44 (2013.01); H05K 1/056 (2013.01); H05K 3/10 (2013.01); H05K 2201/0317 (2013.01); H05K 2203/072 (2013.01);
Abstract
A wiring circuit board includes a support metal layer having thermal conductivity of 5 W/m·K or more, an insulating layer disposed on at least one side in a thickness direction of the support metal layer, a wiring layer disposed on a front surface of the insulating layer, a protective metal film disposed on the entire surface of the support metal layer between the support metal layer and the insulating layer, and a protective thin film disposed on an exposed surface exposed from the protective metal film in the support metal layer.