The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 22, 2022

Filed:

Feb. 13, 2019
Applicant:

Fraunhofer-gesellschaft Zur Foerderung Der Angewandten Forschung E.v., Munich, DE;

Inventors:

Ivan Ndip, Berlin, DE;

Kai Zoschke, Berlin, DE;

Klaus-Dieter Lang, Berlin, DE;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/52 (2006.01); H01Q 1/48 (2006.01); H01Q 1/38 (2006.01); H01Q 21/00 (2006.01); H01Q 1/02 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/526 (2013.01); H01Q 1/02 (2013.01); H01Q 1/38 (2013.01); H01Q 1/48 (2013.01); H01Q 1/523 (2013.01); H01Q 21/0025 (2013.01); H01Q 21/0087 (2013.01);
Abstract

A module unit includes a carrier substrate and an antenna substrate. The carrier substrate at least includes an embedded chip and a redistribution layer arranged on the first main surface. The antenna substrate including a base material includes an antenna structure arranged on the side of the first main surface, and a cavity introduced on the side of the second main surface, the cavity being aligned with the antenna structure at least in areas. The antenna substrate is connected with the second main surface to the first main surface of the carrier substrate, so that the antenna substrate and the carrier substrate form a layer stack.


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