The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 22, 2022

Filed:

Nov. 03, 2020
Applicant:

Kioxia Corporation, Tokyo, JP;

Inventors:

Go Oike, Mie, JP;

Tsuyoshi Sugisaki, Yokkaichi, JP;

Assignee:

KIOXIA CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 16/04 (2006.01); H01L 27/11582 (2017.01); H01L 27/1157 (2017.01); H01L 27/11556 (2017.01); H01L 27/11524 (2017.01); G11C 5/06 (2006.01); H01L 27/11565 (2017.01); G11C 16/08 (2006.01); H01L 27/11519 (2017.01); H01L 29/792 (2006.01);
U.S. Cl.
CPC ...
H01L 27/11582 (2013.01); G11C 5/063 (2013.01); G11C 16/0483 (2013.01); G11C 16/08 (2013.01); H01L 27/1157 (2013.01); H01L 27/11519 (2013.01); H01L 27/11524 (2013.01); H01L 27/11556 (2013.01); H01L 27/11565 (2013.01); H01L 29/792 (2013.01);
Abstract

According to one embodiment, a semiconductor memory device includes a plurality of first interconnect layers, first and second memory pillars, and a plurality of first plugs. The plurality of first interconnect layers include a first array region where the first memory pillar penetrates the plurality of first interconnect layers, a second array region where the second memory pillar penetrates the plurality of first interconnect layers, and a coupling region where a plurality of coupling parts respectively coupled to the plurality of first plugs are formed. Along a first direction parallel to the semiconductor substrate, the first array region, the coupling region, and the second array region are arranged in order.


Find Patent Forward Citations

Loading…