The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 22, 2022
Filed:
Jul. 15, 2020
Samsung Electronics Co., Ltd., Suwon-si, KR;
Sanguk Kim, Cheonan-si, KR;
Abstract
A packaged integrated circuit device includes a frame having a cavity therein and an inner semiconductor chip within the cavity. A lower re-distribution layer is provided, which extends adjacent lower surfaces of the frame and the inner semiconductor chip. The lower re-distribution layer has an opening therein which at least partially exposes the lower surface of the inner semiconductor chip. A lower semiconductor chip is provided, which extends adjacent the lower surface of the inner semiconductor chip, and within the opening in the lower re-distribution layer. This lower re-distribution layer includes: (i) an insulating layer covering the lower surface of the frame, (ii) a re-distribution pattern disposed on the insulating layer, and (iii) a barrier layer, which is disposed on the insulating layer and surrounds at least a portion of the lower semiconductor chip.