The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 22, 2022
Filed:
Jul. 25, 2019
International Business Machines Corporation, Armonk, NY (US);
Chih-Chao Yang, Glenmont, NY (US);
Baozhen Li, South Burlington, VT (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A structure (interconnect or memory structure) is provided that includes a first electrically conductive structure having a concave upper surface embedded in a first interconnect dielectric material layer. A metal-containing cap having a convex bottom surface directly contacts the concave upper surface of the first electrically conductive structure. A metal-containing structure having a planar bottommost surface directly contacts a planar topmost surface of the metal-containing cap. A second electrically conductive structure contacts the planar topmost surface of the metal-containing structure. A second interconnect dielectric material layer is present on the first interconnect dielectric material layer and is located laterally adjacent to an upper portion of the metal-containing cap, the metal-containing structure, and the second electrically conductive structure.